Robustel\u00a0M2M solutions\u00a0can withstand harsh environments in extreme temperatures, humidity and are prone to shocks\/vibrations or severe changes in speed which would normally interfere with the optimal operation of integrated SIM cards.<\/p>\n
Applications include connecting and remotely monitoring of vehicle fleets, solar power arrays and any other remote devices that requires cellular connectivity as either primary or as a redundant network.<\/p>\n
This is achievable with the new technology, \u00a0M2M Form Factor (MFF) SIM chips, which are embedded into Robustel’s \u00a0R3000\u00a0routers for high reliability M2M service in extreme conditions.<\/p>\n
About MFF SIM Chips<\/strong><\/p>\n M2M form factor (MFF) SIM chips, is a new technology and standard for embedded SIM cards with SMD packaging, are M2M optimized to: Robustel\u00a0M2M solutions\u00a0can withstand harsh environments in extreme temperatures, humidity and are prone to sho […]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[24],"tags":[],"class_list":["post-1593","post","type-post","status-publish","format-standard","hentry","category-news"],"acf":[],"yoast_head":"\n
\n1. Survive extremes of vibration, temperature, and humidity
\n2. Endure a long life span (ex: 10 years)
\n3. Occupy a small footprint (miniaturization)
\n4. Withstand and integrate into industrial manufacturing processes<\/p>\n","protected":false},"excerpt":{"rendered":"